- 专利标题： Semiconductor package with plateable encapsulant and a method for manufacturing the same
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申请号： US15448018申请日： 2017-03-02
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公开(公告)号： US10396007B2公开(公告)日： 2019-08-27
- 发明人: Sook Woon Chan , Chau Fatt Chiang , Kok Yau Chua , Soon Lock Goh , Swee Kah Lee , Joachim Mahler , Mei Chin Ng , Beng Keh See , Guan Choon Matthew Nelson Tee
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102016103790 20160303
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L23/31 ; C09D5/00 ; C09D201/00 ; C23C18/16 ; C23C18/18 ; C23C18/34 ; H01L21/56 ; H01L23/29 ; H01L23/66 ; H01L23/00 ; C09D5/24
摘要：
A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.
公开/授权文献
- US20170256472A1 Manufacturing a package using plateable encapsulant 公开/授权日：2017-09-07