Invention Grant
- Patent Title: Semiconductor package with plateable encapsulant and a method for manufacturing the same
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Application No.: US15448018Application Date: 2017-03-02
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Publication No.: US10396007B2Publication Date: 2019-08-27
- Inventor: Sook Woon Chan , Chau Fatt Chiang , Kok Yau Chua , Soon Lock Goh , Swee Kah Lee , Joachim Mahler , Mei Chin Ng , Beng Keh See , Guan Choon Matthew Nelson Tee
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016103790 20160303
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; C09D5/00 ; C09D201/00 ; C23C18/16 ; C23C18/18 ; C23C18/34 ; H01L21/56 ; H01L23/29 ; H01L23/66 ; H01L23/00 ; C09D5/24
Abstract:
A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.
Public/Granted literature
- US20170256472A1 Manufacturing a package using plateable encapsulant Public/Granted day:2017-09-07
Information query
IPC分类:
