Invention Grant
- Patent Title: Light emitting device having leads in resin package
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Application No.: US15886726Application Date: 2018-02-01
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Publication No.: US10411169B2Publication Date: 2019-09-10
- Inventor: Mitsuhiro Isono , Kensuke Maehara , Kazuya Matsuda , Takaaki Kato
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2017-018884 20170203; JP2017-078178 20170411
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/54 ; H01L33/62 ; H01L33/50 ; H01L33/56 ; H01L33/60 ; H01L33/46

Abstract:
A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.
Public/Granted literature
- US20180226544A1 LIGHT EMITTING DEVICE Public/Granted day:2018-08-09
Information query
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