-
公开(公告)号:US10079201B1
公开(公告)日:2018-09-18
申请号:US15924071
申请日:2018-03-16
Applicant: NICHIA CORPORATION
Inventor: Hironao Oku , Toshiyuki Hashimoto , Mitsuhiro Isono , Takao Ishihara , Takaaki Kato
Abstract: A lead frame includes: a plurality of units each including a first lead portion and a second lead portion arranged in a first direction, wherein the units are arranged in the first direction and in a second direction perpendicular to the first direction, and the first lead portion and the second lead portion of each unit are adjacent, in the second direction, to the first lead portion and the second lead portion of an adjacent one of the units that is adjacent in the second direction; a plurality of first suspension portions; and a plurality of connecting portions. Each of the first suspension portions connects, in the second direction, the first lead portions of units that are adjacent to each other in the second direction.
-
公开(公告)号:US10332824B2
公开(公告)日:2019-06-25
申请号:US16105756
申请日:2018-08-20
Applicant: NICHIA CORPORATION
Inventor: Hironao Oku , Toshiyuki Hashimoto , Mitsuhiro Isono , Takao Ishihara , Takaaki Kato
Abstract: A lead frame includes: a plurality of units each including a first lead portion and a second lead portion arranged in a first direction, wherein the units are arranged in the first direction and in a second direction perpendicular to the first direction, and the first lead portion and the second lead portion of each unit are adjacent, in the second direction, to the first lead portion and the second lead portion of an adjacent one of the units that is adjacent in the second direction; a plurality of first suspension portions; and a plurality of connecting portions. Each of the first suspension portions connects, in the second direction, the first lead portions of units that are adjacent to each other in the second direction.
-
公开(公告)号:US10763407B2
公开(公告)日:2020-09-01
申请号:US16369715
申请日:2019-03-29
Applicant: NICHIA CORPORATION
Inventor: Yoshio Ichihara , Mitsuhiro Isono
IPC: H01L33/54 , H01L33/48 , H01L33/56 , H01L33/60 , H01L23/00 , H01L33/62 , H01L23/16 , H01L23/31 , H01L23/04 , H01L23/02 , H01L23/28 , H01L33/44 , H01L23/10 , H01L33/52
Abstract: Alight emitting device includes a package, alight emitting element, and a light-transmissive encapsulant. The package has a top surface and a recessed portion formed with an opening at the top surface. The light emitting element is located on a bottom surface of the recessed portion. The light-transmissive encapsulant is supplied in the recessed portion. The package is provided with a groove formed in the top surface and surrounding the opening. A surface of the groove includes depressed portions and projecting portions. The encapsulant covers at least a part of the surface of the groove, and a portion of the encapsulant that covers the surface of the groove includes a surface irregularity.
-
公开(公告)号:US10411169B2
公开(公告)日:2019-09-10
申请号:US15886726
申请日:2018-02-01
Applicant: NICHIA CORPORATION
Inventor: Mitsuhiro Isono , Kensuke Maehara , Kazuya Matsuda , Takaaki Kato
Abstract: A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.
-
-
-