公开(公告)号：US10411169B2

公开(公告)日：2019-09-10

申请号：US15886726

申请日：2018-02-01

Applicant: NICHIA CORPORATION

Inventor： Mitsuhiro Isono ,  Kensuke Maehara ,  Kazuya Matsuda ,  Takaaki Kato

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/46

Abstract: A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.