- Patent Title: Stacked memory chip device with enhanced data protection capability
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Application No.: US15640182Application Date: 2017-06-30
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Publication No.: US10459809B2Publication Date: 2019-10-29
- Inventor: Hussein Alameer , Uksong Kang , Kjersten E. Criss , Rajat Agarwal , Wei Wu , John B. Halbert
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G06F11/16 ; G06F11/10 ; G11C5/04 ; G11C7/10 ; G11C29/42 ; G11C29/52 ; G11C29/00 ; G11C7/24 ; H01L25/065 ; G11C29/04

Abstract:
A stacked memory chip device is described. The stacked memory chip device includes a plurality of stacked memory chips. The stacked memory chip device includes read/write logic circuitry to service read/write requests for cache lines kept within the plurality of stacked memory chips. The stacked memory chip device includes data protection circuitry to store information to protect substantive data of cache lines in the plurality of stacked memory chips, where, the information is kept in more than one of the plurality of stacked memory chips, and where, any subset of the information that protects respective substantive information of a particular one of the cache lines is not stored in a same memory chip with the respective substantive information.
Public/Granted literature
- US20190004909A1 STACKED MEMORY CHIP DEVICE WITH ENHANCED DATA PROTECTION CAPABILITY Public/Granted day:2019-01-03
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