Invention Grant
- Patent Title: Quantum dot-polymer micronized composite, production method thereof, and article and electronic device including the same
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Application No.: US15378791Application Date: 2016-12-14
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Publication No.: US10472562B2Publication Date: 2019-11-12
- Inventor: Jeong Hee Lee , Hyun A Kang , Tae Hyung Kim , Eun Joo Jang , Nayoun Won , Jiho You
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2015-0181292 20151217
- Main IPC: C09K11/02
- IPC: C09K11/02 ; B05D3/00 ; C08K3/16 ; C08K3/32 ; C08K9/04 ; C08L23/08 ; C09K11/70 ; C09K11/88 ; H01L33/50 ; H01L33/56 ; B82Y20/00 ; B82Y40/00

Abstract:
A quantum dot-polymer micronized composite includes a first polymer matrix; a plurality of quantum dots dispersed in the first polymer matrix; and at least one of an additive selected from a clay particle embedded in the first polymer matrix and a metal halide dispersed in the first polymer matrix, wherein the quantum dot-polymer micronized composite has an average particle size of less than or equal to about 100 micrometers, a production method thereof, and an article and an electronic device including the micronized composite are provided.
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