公开(公告)号：US20240290915A1

公开(公告)日：2024-08-29

申请号：US18581676

申请日：2024-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juwon Jeong ,  Sanghyun Kim ,  Jiho You ,  Sungwoo Choi

IPC: H01L33/46 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/502 ,  H01L33/60

Abstract: A semiconductor light-emitting device includes a light emitting structure, a wavelength conversion member arranged on an upper surface of the light emitting structure, the wavelength conversion member including a first surface in contact with the light emitting structure, a second surface opposite to the first surface, and a sidewall, wherein the first surface entirely covers the upper surface of the light emitting structure, and a portion of the sidewall adjacent to the first surface is slanted with respect to the first surface, and a coating layer arranged on the second surface of the wavelength conversion member, the coating layer including a first material layer and a second material layer alternately stacked on the second surface, wherein the first material layer includes an oxide, and the second material layer includes magnesium fluoride (MgF2), wherein the second material layer is arranged at an uppermost surface of the coating layer.

公开(公告)号：US10472562B2

公开(公告)日：2019-11-12

申请号：US15378791

申请日：2016-12-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Hee Lee ,  Hyun A Kang ,  Tae Hyung Kim ,  Eun Joo Jang ,  Nayoun Won ,  Jiho You

IPC: C09K11/02 ,  B05D3/00 ,  C08K3/16 ,  C08K3/32 ,  C08K9/04 ,  C08L23/08 ,  C09K11/70 ,  C09K11/88 ,  H01L33/50 ,  H01L33/56 ,  B82Y20/00 ,  B82Y40/00

Abstract: A quantum dot-polymer micronized composite includes a first polymer matrix; a plurality of quantum dots dispersed in the first polymer matrix; and at least one of an additive selected from a clay particle embedded in the first polymer matrix and a metal halide dispersed in the first polymer matrix, wherein the quantum dot-polymer micronized composite has an average particle size of less than or equal to about 100 micrometers, a production method thereof, and an article and an electronic device including the micronized composite are provided.