Invention Grant
- Patent Title: Magnetoresistive random access memory (MRAM) structure and method of forming the same
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Application No.: US15664513Application Date: 2017-07-31
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Publication No.: US10546996B2Publication Date: 2020-01-28
- Inventor: Chun-Chieh Mo , Tsai-Hao Hung , Shih-Chi Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01L43/02 ; H01L43/12 ; G11C11/16

Abstract:
A magnetoresistive random access memory (MRAM) structure and a method of forming the same are provided. The MRAM structure includes a conductive pillar over a substrate, a first MTJ spacer and a first conductive layer. The first MTJ spacer surrounds the conductive pillar. The first conductive layer surrounds the first MTJ spacer. The first magnetic tunnel junction (MTJ) spacer includes a first electrode, a second electrode and a magnetic tunnel junction (MTJ) layer. The first electrode is in contact with the conductive pillar and the substrate. The second electrode is positioned over the first electrode and in contact with the first conductive layer. The magnetic tunnel junction (MTJ) layer is positioned between the first electrode and the second electrode.
Public/Granted literature
- US20190036013A1 MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM) STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2019-01-31
Information query
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