- Patent Title: Semiconductor package with a through port for sensor applications
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Application No.: US15692938Application Date: 2017-08-31
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Publication No.: US10549985B2Publication Date: 2020-02-04
- Inventor: Dominic Maier , Matthias Steiert , Chau Fatt Chiang , Christian Geissler , Bernd Goller , Thomas Kilger , Johannes Lodermeyer , Franz-Xaver Muehlbauer , Chee Yang Ng , Beng Keh See , Claus Waechter
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
Public/Granted literature
- US20180148322A1 Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture Public/Granted day:2018-05-31
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