- 专利标题: Static random access memory structure
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申请号: US16162340申请日: 2018-10-16
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公开(公告)号: US10559573B2公开(公告)日: 2020-02-11
- 发明人: Shu-Ru Wang , Ching-Cheng Lung , Yu-Tse Kuo , Chien-Hung Chen , Chun-Hsien Huang , Li-Ping Huang , Chun-Yen Tseng , Meng-Ping Chuang
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 优先权: CN201710864959 20170922
- 主分类号: H01L27/11
- IPC分类号: H01L27/11 ; G11C11/412 ; G11C5/06 ; G11C8/14 ; G11C7/18 ; H01L27/02 ; H01L27/12 ; H01L27/092
摘要:
A layout pattern of a static random access memory (SRAM) includes a substrate, a first pull-up transistor (PL1), a first pull-down transistor (PD1), a second (PL2), and a second pull-down transistor (PD2) on the substrate, and a first pass gate transistor (PG1A), a second pass gate transistor (PG1B), a third pass gate transistor (PG2A) and a fourth pass gate transistor (PG2B), wherein the PG1A and the PG1B comprise a first fin structure, the PG2A and the PG2B comprise a second fin structure, a first local interconnection layer disposed between the PG1A and the PG1B and disposed on the fin structures of the PL1 and the PD1, a second local interconnection layer disposed between the PG2A and the PG2B and disposed between the fin structures of the PL2 and the PD2, the first local interconnection layer and the second local interconnection layer are monolithically formed structures respectively.
公开/授权文献
- US20190096892A1 STATIC RANDOM ACCESS MEMORY STRUCTURE 公开/授权日:2019-03-28
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