Invention Grant
- Patent Title: Substrate liquid processing apparatus
-
Application No.: US15535882Application Date: 2015-12-15
-
Publication No.: US10573539B2Publication Date: 2020-02-25
- Inventor: Hiroshi Komiya , Yasuhiro Takaki , Shinichi Umeno , Koji Tanaka , Takami Satoh , Atsushi Anamoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-253576 20141216; JP2015-208586 20151023
- International Application: PCT/JP2015/085092 WO 20151215
- International Announcement: WO2016/098776 WO 20160623
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/04

Abstract:
A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.
Public/Granted literature
- US20180358240A1 SUBSTRATE LIQUID PROCESSING APPARATUS Public/Granted day:2018-12-13
Information query
IPC分类: