Invention Grant
- Patent Title: Resin composite
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Application No.: US15500735Application Date: 2015-09-30
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Publication No.: US10576709B2Publication Date: 2020-03-03
- Inventor: Hironori Kobayashi , Haruhiko Matsuura , Yusuke Kuwabara
- Applicant: SEKISUI PLASTICS CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee: SEKISUI PLASTICS CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-200862 20140930
- International Application: PCT/JP2015/077802 WO 20150930
- International Announcement: WO2016/052645 WO 20160407
- Main IPC: B32B5/18
- IPC: B32B5/18 ; B32B5/24 ; B29C43/12 ; B29C43/18 ; B32B27/34 ; C08J5/04 ; B29C43/34 ; C08J9/04 ; C08J9/36 ; B32B37/10 ; C08J5/24 ; B29K105/08 ; B29K105/04 ; B29K423/00 ; B29K505/00 ; B29K509/08 ; B29L9/00 ; B29K509/00 ; B29C44/50 ; B29K507/04 ; B29K77/00
Abstract:
The resin composite of the present invention has a polyamide-based resin expanded sheet, and a fiber-reinforced resin layer integrally laminated on a surface of the polyamide-based resin expanded sheet.
Public/Granted literature
- US20170217127A1 RESIN COMPOSITE Public/Granted day:2017-08-03
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