Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and recording medium
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Application No.: US15635388Application Date: 2017-06-28
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Publication No.: US10689762B2Publication Date: 2020-06-23
- Inventor: Akira Murata , Satoshi Kaneko , Kazuki Motomatsu , Kazunori Sakamoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@cfdc191
- Main IPC: C23C18/16
- IPC: C23C18/16 ; H01L21/67 ; H01L21/687 ; H01L21/677 ; C23C18/18

Abstract:
A substrate processing apparatus can suppress particle generation on a substrate, and can reduce a consumption amount of a processing liquid. A substrate processing apparatus 1 includes a processing chamber 30 having a processing space 31 in which a substrate W is processed; a vaporizing tank 60, configured to store the processing liquid therein, having a vaporization space 61 in which the stored processing liquid is allowed to be vaporized; a decompression driving unit 70 configured to decompress the vaporization space 61; and a control unit 18. The control unit 18 vaporizes the processing liquid into the processing gas by decompressing the vaporization space 61 without through the processing space 31, and then, vaporizes the processing liquid into the processing gas by decompressing the vaporization space 61 through the processing space 31, and supplies an inert gas into the vaporization space 61.
Public/Granted literature
- US20180010252A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM Public/Granted day:2018-01-11
Information query
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