Invention Grant
- Patent Title: Laser uniformly machining apparatus and method
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Application No.: US15410311Application Date: 2017-01-19
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Publication No.: US10705346B2Publication Date: 2020-07-07
- Inventor: Pin-Hao Hu , Mao-Chi Lin , Yu-Chung Lin , Min-Kai Lee
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@41868dc5
- Main IPC: G02B27/09
- IPC: G02B27/09 ; B23K26/073 ; B23K26/351 ; B23K26/06 ; G02B27/30 ; B23K101/36

Abstract:
A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.
Public/Granted literature
- US20180101015A1 LASER UNIFORMLY MACHINING APPARATUS AND METHOD Public/Granted day:2018-04-12
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