公开(公告)号：US11406022B2

公开(公告)日：2022-08-02

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H01L23/498

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

公开(公告)号：US09353929B2

公开(公告)日：2016-05-31

申请号：US14140482

申请日：2013-12-25

Applicant: Industrial Technology Research Institute

Inventor： Yu-Chung Lin ,  Min-Kai Lee ,  Sung-Ho Liu

IPC: F21V7/00 ,  F21V7/22 ,  F21V13/02 ,  F21V13/04 ,  H01S3/00

CPC classification number: F21V7/0033 ,  F21V7/22 ,  F21V13/02 ,  F21V13/04 ,  G02B27/48 ,  H01S3/005

Abstract: A beam diffusing module including a light incident terminal, a light emitting terminal, a first reflective plate and a second reflective plate is provided. The first reflective plate and the second reflective plate are disposed on a transmission path of a laser beam. At least one of the first reflective plate and the second reflective plate has a plurality of reflective micorstructures. The reflective micorstructures are arranged along a second direction from the light incident terminal towards the light emitting terminal. At least a part of the laser beam enters the beam diffusing module through the light incident terminal and emerges from the light emitting terminals after being reflected repeatedly by the first reflective plate and the second reflective plate to cause an M squared of the laser beam to be redistributed along a first direction. A beam generating system is also provided.

Abstract translation: 提供了包括光入射端子，发光端子，第一反射板和第二反射板的光束漫射模块。 第一反射板和第二反射板设置在激光束的传输路径上。 第一反射板和第二反射板中的至少一个具有多个反射微结构。 反射微结构沿着从光入射端子朝向发光端子的第二方向布置。 激光束的至少一部分通过光入射端子进入光束扩散模块，并且在由第一反射板和第二反射板反复反射之后从发光端子出射，使得激光束的M平方成为 沿着第一个方向重新分配。 还提供了一种束生成系统。

公开(公告)号：US20160147214A1

公开(公告)日：2016-05-26

申请号：US14945431

申请日：2015-11-19

Applicant: Industrial Technology Research Institute

Inventor： Shao-Chuan Lu ,  Yu-Chung Lin ,  Jie-Ting Tseng ,  Min-Kai Lee

IPC: G05B19/19 ,  B23K26/042

CPC classification number: G05B19/19 ,  B23K26/04 ,  B23K26/042 ,  B23K26/082 ,  G02B7/102 ,  G02B26/0816 ,  G02B26/101 ,  G05B2219/37304

Abstract: A three-dimension laser processing apparatus including a laser source, a zoom lens set, a scanning mirror module, a visual module unit and a control unit is provided. The laser source provides a laser beam. The zoom lens set and the scanning mirror module are both located on the transmitting path of the laser beam. The visual module unit has a visible area. The control unit is electrically connected with and adjusts the zoom lens set and the scanning mirror module to make the laser beam focused on a plurality of reference surfaces in a three-dimension working space and make a plurality of positions of an image in the three-dimension working space focused on a center of the visible area correspondingly through the zoom lens set and an image lens set of the visual module unit. Besides, a positioning error correction method is provided.

Abstract translation: 提供了包括激光源，变焦透镜组，扫描镜模块，可视模块单元和控制单元的三维激光加工设备。 激光源提供激光束。 变焦透镜组和扫描镜模块都位于激光束的传送路径上。 视觉模块单元具有可见区域。 控制单元电连接并调整变焦透镜组和扫描反射镜模块，以使激光束聚焦在三维工作空间中的多个参考表面上，并使三维图像中的多个位置位于三维空间中， 尺寸工作空间通过变焦透镜组和可视模块单元的图像透镜组相应地集中在可见区域的中心。 此外，提供了一种定位误差校正方法。

公开(公告)号：US20170066680A1

公开(公告)日：2017-03-09

申请号：US14968902

申请日：2015-12-15

Applicant: Industrial Technology Research Institute

Inventor： Chun-Jen Gu ,  Yu-Chung Lin ,  Mao-Chi Lin ,  Chun-Ming Chen

IPC: C03B33/10

CPC classification number: B23K26/14 ,  B23K26/389 ,  B23K2103/54

Abstract: In an embodiment, a laser drilling apparatus adapted to a tempered glass includes a laser source, a drilling unit, a gas supply source, a heater and an air supplier. The laser source provides a laser beam. The drilling unit has a zoom lens set and a laser scanner unit. The laser beam passes through the zoom lens set and the laser scanner unit. The gas supply source supplies an air flow. The heater is disposed on a flow channel of the air flow and heats up the air flow. The air supplier has a nozzle. Both the laser beam and the heated-up air flow reach an area to be machined of the tempered glass through the nozzle. In an embodiment, a laser drilling method for the tempered glass is also provided.

Abstract translation: 在一个实施例中，适用于钢化玻璃的激光钻孔设备包括激光源，钻孔单元，气体供应源，加热器和空气供应器。 激光源提供激光束。 钻孔单元具有变焦透镜组和激光扫描器单元。 激光束通过变焦镜头组和激光扫描器单元。 供气源供应气流。 加热器设置在空气流的流动通道上并加热空气流。 空气供应商有一个喷嘴。 激光束和加热空气流都通过喷嘴到达要加工的钢化玻璃的区域。 在一个实施例中，还提供了用于钢化玻璃的激光钻孔方法。

公开(公告)号：US08780446B2

公开(公告)日：2014-07-15

申请号：US13794812

申请日：2013-03-12

Applicant: Industrial Technology Research Institute

Inventor： Min-Kai Lee ,  Yu-Chung Lin ,  Cheng-Huan Chen ,  Sung-Ho Liu

IPC: G02B27/10

CPC classification number: G02B3/005 ,  G02B27/48

Abstract: A beam generating apparatus includes a laser light source, a speckle suppressing module, a light homogenizing module and a driving unit. The laser light source outputs a laser beam. The speckle suppressing module includes two biconic lenses and a diffuser. The first biconic lens is disposed on a transmission path of the laser beam. The diffuser is located on the transmission path of the laser beam between the first and second biconic lenses. The light homogenizing module is disposed on the transmission path of the laser beam from the second biconic lens. The driving unit drives the diffuser to move with respect to the laser beam so that the ratio of the M2 of the laser beam exiting from the second biconic lens in a first direction to the M2 thereof in a second direction is greater than 2, wherein the two directions are substantially perpendicular to each other.

Abstract translation: 光束产生装置包括激光光源，散斑抑制模块，光匀化模块和驱动单元。 激光光源输出激光束。 斑点抑制模块包括两个双锥透镜和漫射器。 第一双透镜设置在激光束的传输路径上。 扩散器位于第一和第二双锥透镜之间的激光束的传输路径上。 光均质化模块设置在来自第二双锥透镜的激光束的传输路径上。 驱动单元驱动扩散器相对于激光束移动，使得从第二方向离开第二双锥透镜的激光束的M2在第二方向上的比例大于2，其中， 两个方向基本上彼此垂直。

公开(公告)号：US20240173795A1

公开(公告)日：2024-05-30

申请号：US18085657

申请日：2022-12-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： FU-LUNG CHOU ,  Chien-Jung Huang ,  Yu-Chung Lin

IPC: B23K26/06 ,  B23K26/03 ,  B23K26/38

CPC classification number: B23K26/0648 ,  B23K26/032 ,  B23K26/38 ,  B23K26/402

Abstract: A cavity forming method includes the steps of: providing the material modification processing device; according to the cavity topography of the workpiece, utilizing the material modification processing device to perform local modification including: calculating the laser-light shaping and scanning information, and based on the laser-light shaping and scanning information to have the optical axis adjustment unit to adjust positions of the laser-light shaping and scanning processing module and the processing stage, such that the area of the workpiece to be projected by the Bessel beam can be formed as the modified area; and, etching the modified area to form a cavity of the cavity topography. In additional, a material modification processing device is also provided.

公开(公告)号：US11338392B2

公开(公告)日：2022-05-24

申请号：US16279186

申请日：2019-02-19

Applicant: Industrial Technology Research Institute

Inventor： Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang ,  Yu-Chung Lin ,  Min-Kai Lee

IPC: B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  B23K26/362 ,  B23K103/00 ,  B23K101/36 ,  B23K101/18

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

公开(公告)号：US20220141961A1

公开(公告)日：2022-05-05

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K3/00 ,  H05K1/11

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

公开(公告)号：US11052436B2

公开(公告)日：2021-07-06

申请号：US16133199

申请日：2018-09-17

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Ming Chen ,  Chien-Jung Huang ,  Yu-Chung Lin ,  Chieh-Ting Tseng ,  Min-Kai Lee

IPC: B08B7/00 ,  B23K26/064 ,  B23K26/06 ,  B23K26/067

Abstract: A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.

公开(公告)号：US10705346B2

公开(公告)日：2020-07-07

申请号：US15410311

申请日：2017-01-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pin-Hao Hu ,  Mao-Chi Lin ,  Yu-Chung Lin ,  Min-Kai Lee

IPC: G02B27/09 ,  B23K26/073 ,  B23K26/351 ,  B23K26/06 ,  G02B27/30 ,  B23K101/36

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.