Invention Grant
- Patent Title: Method and apparatus for inspecting defects on transparent substrate and method emitting incident light
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Application No.: US16346711Application Date: 2017-10-31
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Publication No.: US10732126B2Publication Date: 2020-08-04
- Inventor: Chong Pyung An , Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Hyeong-cheol Lee , Michal Mlejnek , Johannes Moll , Rajeshkannan Palanisamy , Sung-jong Pyo , Amanda Kathryn Thomas , Correy Robert Ustanik
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- International Application: PCT/US2017/059220 WO 20171031
- International Announcement: WO2018/085237 WO 20180511
- Main IPC: G01N21/896
- IPC: G01N21/896 ; G01N21/958

Abstract:
A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.
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