Invention Grant
- Patent Title: Metal contacts on metal gates and methods thereof
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Application No.: US16035819Application Date: 2018-07-16
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Publication No.: US10755945B2Publication Date: 2020-08-25
- Inventor: Pang-Sheng Chang , Yu-Feng Yin , Chao-Hsun Wang , Kuo-Yi Chao , Fu-Kai Yang , Mei-Yun Wang , Feng-Yu Chang , Chen-Yuan Kao , Chia-Yang Hung , Chia-Sheng Chang , Shu-Huei Suen , Jyu-Horng Shieh , Sheng-Liang Pan , Jack Kuo-Ping Kuo , Shao-Jyun Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hayne and Boone LLP
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L29/49 ; H01L29/78 ; H01L21/28 ; H01L29/66

Abstract:
A method includes forming a metal gate structure, wherein the metal gate structure includes a gate dielectric layer and a gate electrode; performing a surface treatment to a top surface of the metal gate structure, wherein the surface treatment converts a top portion of the gate electrode to an oxidation layer; forming a conductive layer above the gate electrode, wherein the forming of the conductive layer includes substituting oxygen in the oxidation layer with a metallic element; and forming a contact feature above the metal gate structure, wherein the contact feature is in direct contact with the conductive layer.
Public/Granted literature
- US20200020541A1 Metal Contacts on Metal Gates and Methods Thereof Public/Granted day:2020-01-16
Information query
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