Invention Grant
- Patent Title: Polishing composition
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Application No.: US15562692Application Date: 2016-03-11
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Publication No.: US10781342B2Publication Date: 2020-09-22
- Inventor: Shogo Onishi , Takeki Sato , Yukinobu Yoshizaki , Koichi Sakabe
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP
- Agency: Katten Munchin Rosenman LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@10a6013c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@61eb0419 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@288df6bc
- International Application: PCT/JP2016/057837 WO 20160311
- International Announcement: WO2016/158324 WO 20161006
- Main IPC: B24B37/04
- IPC: B24B37/04 ; C09G1/02 ; C09K3/14 ; H01L21/3105
Abstract:
An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film.Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.
Public/Granted literature
- US20180057711A1 POLISHING COMPOSITION Public/Granted day:2018-03-01
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