公开(公告)号：US10781342B2

公开(公告)日：2020-09-22

申请号：US15562692

申请日：2016-03-11

Applicant: FUJIMI INCORPORATED

Inventor： Shogo Onishi ,  Takeki Sato ,  Yukinobu Yoshizaki ,  Koichi Sakabe

IPC: B24B37/04 ,  C09G1/02 ,  C09K3/14 ,  H01L21/3105

Abstract: An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film.Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.

公开(公告)号：US10414019B2

公开(公告)日：2019-09-17

申请号：US15764271

申请日：2016-09-21

Applicant: FUJIMI INCORPORATED

Inventor： Takeki Sato ,  Yukinobu Yoshizaki ,  Shogo Onishi

IPC: B24B37/04 ,  C09G1/02 ,  C09K3/14 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321

Abstract: An object of the present invention is to provide a polishing composition enabling polishing of an object to be polished at higher speed.Provided is a polishing composition used for polishing an object to be polished in which the polishing composition contains surface-modified abrasive grains, in which an ionic dispersant is directly modified on the surface of the abrasive grains, and dispersing medium, and aggregation of the abrasive grains is suppressed in the dispersing medium.