Invention Grant
- Patent Title: Methods of forming tungsten pillars
-
Application No.: US15969119Application Date: 2018-05-02
-
Publication No.: US10784107B2Publication Date: 2020-09-22
- Inventor: Abhijit Basu Mallick , Pramit Manna , Yihong Chen , Ziqing Duan , Rui Cheng , Shishi Jiang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/3105 ; H01L21/321 ; H01L21/033 ; H01L21/768 ; H01L21/3215
Abstract:
Methods of forming self-aligned patterns are described. A film material is deposited on a patterned film to fill and cover features formed by the patterned film. The film material is recessed to a level below the top of the patterned film. The recessed film is converted to a metal film by exposure to a metal precursor followed by volumetric expansion of the metal film.
Public/Granted literature
- US20180323068A1 Methods of Forming Tungsten Pillars Public/Granted day:2018-11-08
Information query
IPC分类:
