Invention Grant
- Patent Title: Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
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Application No.: US16206108Application Date: 2018-11-30
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Publication No.: US10790158B2Publication Date: 2020-09-29
- Inventor: Yaojian Lin , Kang Chen , Hin Hwa Goh , Il Kwon Shim
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Brian M. Kaufman; Robert D. Atkins
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/13 ; H01L23/498 ; H01L23/538
Abstract:
A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate.
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