Invention Grant
- Patent Title: Method and apparatus to control temperature of a semiconductor die in a computer system
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Application No.: US16292218Application Date: 2019-03-04
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Publication No.: US10796977B2Publication Date: 2020-10-06
- Inventor: John Fallin , Daniel J. Ragland , Jonathan P. Douglas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law, PC
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/20 ; H01L23/34 ; H01L23/367 ; H01L23/467 ; H01L23/473 ; G06F1/20 ; G06F1/26 ; G06F17/50 ; G11C5/00 ; G11C29/50 ; G06F11/14
Abstract:
Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
Public/Granted literature
- US20200286804A1 METHOD AND APPARATUS TO CONTROL TEMPERATURE OF A SEMICONDUCTOR DIE IN A COMPUTER SYSTEM Public/Granted day:2020-09-10
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