Invention Grant
- Patent Title: Light-emitting diode package with light-altering material
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Application No.: US16686457Application Date: 2019-11-18
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Publication No.: US10811573B2Publication Date: 2020-10-20
- Inventor: Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/52 ; H01L33/26 ; H01L33/60 ; H01L33/50

Abstract:
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
Public/Granted literature
- US20200105984A1 LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL Public/Granted day:2020-04-02
Information query
IPC分类: