Light emitting diodes, components and related methods

    公开(公告)号:US11107857B2

    公开(公告)日:2021-08-31

    申请号:US15912155

    申请日:2018-03-05

    Applicant: Cree, Inc.

    Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    公开(公告)号:US20190058003A1

    公开(公告)日:2019-02-21

    申请号:US15912155

    申请日:2018-03-05

    Applicant: Cree, Inc.

    Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

    Light emitting diode packages
    3.
    发明授权

    公开(公告)号:US11189766B2

    公开(公告)日:2021-11-30

    申请号:US16249246

    申请日:2019-01-16

    Applicant: Cree, Inc.

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.

    LUMIPHORIC ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES

    公开(公告)号:US20210105873A1

    公开(公告)日:2021-04-08

    申请号:US16592364

    申请日:2019-10-03

    Applicant: Cree, Inc.

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.

    Light-emitting diode package with light-altering material

    公开(公告)号:US10811573B2

    公开(公告)日:2020-10-20

    申请号:US16686457

    申请日:2019-11-18

    Applicant: Cree, Inc.

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS
    6.
    发明申请
    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS 审中-公开
    发光二极管,组件和相关方法

    公开(公告)号:US20170069606A1

    公开(公告)日:2017-03-09

    申请号:US15264547

    申请日:2016-09-13

    Applicant: Cree, Inc.

    Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.

    Abstract translation: 提供发光二极管(LED)设备,组件和系统。 LED装置包括其上布置有多个LED的基座。 安装在基座上的LED可以以预定尺寸间隔开以控制多个LED中的每一个之间的间隙。 通过控制LED之间的间隙,可以优化来自LED器件的光学输出,包括改善发射和/或颜色均匀性,最小化或消除光发射中的死点,和/或最小化或消除光学十字。 磷光体层可以在它们之间的间隙中设置在多个LED上以及LED之间。

    LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL

    公开(公告)号:US20210005793A1

    公开(公告)日:2021-01-07

    申请号:US17016701

    申请日:2020-09-10

    Applicant: Cree, Inc.

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    Light-emitting diode package with light-altering material

    公开(公告)号:US10522722B2

    公开(公告)日:2019-12-31

    申请号:US15957454

    申请日:2018-04-19

    Applicant: Cree, Inc.

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    公开(公告)号:US20190057954A1

    公开(公告)日:2019-02-21

    申请号:US15681205

    申请日:2017-08-18

    Applicant: Cree, Inc.

    Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

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