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公开(公告)号：US11189766B2
公开(公告)日：2021-11-30
申请号：US16249246
申请日：2019-01-16
Applicant: Cree, Inc.
Inventor： Arthur F. Pun , Colin Blakely , Kyle Damborsky , Jae-Hyung Jeremiah Park
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L33/32 , H01L33/64
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.
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公开(公告)号：US11145689B2
公开(公告)日：2021-10-12
申请号：US16203709
申请日：2018-11-29
Applicant: Cree, Inc.
Inventor： Nikolas Hall , Derek Miller , Anoop Mathew , Colin Blakely , Luis Breva , Jesse Reiherzer , David Todd Emerson
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.
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公开(公告)号：US11101411B2
公开(公告)日：2021-08-24
申请号：US16453447
申请日：2019-06-26
Applicant: Cree, Inc.
Inventor： Peter Scott Andrews , Colin Blakely , Jesse Reiherzer , Arthur F. Pun
Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. LED packages are disclosed that include an LED chip with multiple discrete active layer portions mounted on a submount. The LED packages may further include wavelength conversion elements and light-altering materials. The multiple discrete active layer portions may be electrically connected in series, parallel, or in individually addressable arrangements. The LED chip with the multiple discrete active layer portions may provide the LED package with improved brightness, improved alignment, simplified manufacturing, and reduced costs.
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公开(公告)号：US20210105873A1
公开(公告)日：2021-04-08
申请号：US16592364
申请日：2019-10-03
Applicant: Cree, Inc.
Inventor： Aaron Francis , Kyle Damborsky , Robert Wilcox , Jasper Cabalu , Colin Blakely
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.
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公开(公告)号：US10811573B2
公开(公告)日：2020-10-20
申请号：US16686457
申请日：2019-11-18
Applicant: Cree, Inc.
Inventor： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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Patent Agency Ranking
公开(公告)号：US10991861B2
公开(公告)日：2021-04-27
申请号：US15280438
申请日：2016-09-29
Applicant: Cree, Inc.
Inventor： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
IPC: H01L25/16 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L25/075 , H01L33/32
Abstract: Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US20210005793A1
公开(公告)日：2021-01-07
申请号：US17016701
申请日：2020-09-10
Applicant: Cree, Inc.
Inventor： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：US10522722B2
公开(公告)日：2019-12-31
申请号：US15957454
申请日：2018-04-19
Applicant: Cree, Inc.
Inventor： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：USD926714S1
公开(公告)日：2021-08-03
申请号：US29711302
申请日：2019-10-30
Applicant: Cree, Inc.
Designer： Robert Wilcox , Colin Blakely
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公开(公告)号：US11024613B2
公开(公告)日：2021-06-01
申请号：US16675750
申请日：2019-11-06
Applicant: Cree, Inc.
Inventor： David Suich , Arthur F. Pun , Colin Blakely
IPC: H01L25/075 , H01L33/62 , H01L33/26
Abstract: Lumiphoric material region arrangements are provided for light-emitting diode (LED) packages. Certain aspects relate to arrangements of light-altering materials and lumiphoric material regions for LED packages. Lumiphoric material regions over corresponding LED chips may include increased sizes relative to overall LED package dimensions. Lumiphoric material regions may be arranged to extend to certain peripheral edges of an LED package. Multiple lumiphoric material regions and corresponding LED chips may be arranged in close proximity to one another to provide LED packages with multiple and selectable illumination characteristics. Light-altering materials may be arranged that at least partially define certain peripheral edges of lumiphoric material regions. The light-altering materials may form one or more nonintersecting segments arranged about the lumiphoric material regions. Certain aspects relate to LED packages having one or more of reduced sizes, increased light output, and reduced fabrication steps.
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