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公开(公告)号：US10811573B2
公开(公告)日：2020-10-20
申请号：US16686457
申请日：2019-11-18
申请人： Cree, Inc.
发明人： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：US20170098746A1
公开(公告)日：2017-04-06
申请号：US15280438
申请日：2016-09-29
申请人： Cree, Inc.
发明人： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
CPC分类号： H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0041
摘要： Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US10991861B2
公开(公告)日：2021-04-27
申请号：US15280438
申请日：2016-09-29
申请人： Cree, Inc.
发明人： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
IPC分类号： H01L25/16 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L25/075 , H01L33/32
摘要： Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US20210005793A1
公开(公告)日：2021-01-07
申请号：US17016701
申请日：2020-09-10
申请人： Cree, Inc.
发明人： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：US10522722B2
公开(公告)日：2019-12-31
申请号：US15957454
申请日：2018-04-19
申请人： Cree, Inc.
发明人： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：US20200105984A1
公开(公告)日：2020-04-02
申请号：US16686457
申请日：2019-11-18
申请人： Cree, Inc.
发明人： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：US20190326485A1
公开(公告)日：2019-10-24
申请号：US15957454
申请日：2018-04-19
申请人： Cree, Inc.
发明人： Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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