Invention Grant
- Patent Title: Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
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Application No.: US15772352Application Date: 2016-11-04
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Publication No.: US10822465B2Publication Date: 2020-11-03
- Inventor: Tetsuya Kogiso , Tomohiro Koda , Masayoshi Kido
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@79f24a
- International Application: PCT/JP2016/082839 WO 20161104
- International Announcement: WO2017/078152 WO 20170511
- Main IPC: C08J7/04
- IPC: C08J7/04 ; B05D7/04 ; C08G18/75 ; C08L75/04 ; C08G18/44 ; B32B27/20 ; H05K3/28 ; B32B27/34 ; B32B17/06 ; B32B27/28 ; B32B15/08 ; B32B7/12 ; B32B27/38 ; B05D3/00 ; B05D7/24 ; C08K5/00 ; C08K5/18 ; C08K5/3417 ; C08K5/5313 ; C08L79/08 ; C09D4/00 ; C09D7/63 ; B05D1/02 ; C09D175/04 ; H05K1/03 ; H05K1/02 ; B05D3/10 ; C09D133/10
Abstract:
A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 μm or less.
Public/Granted literature
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