公开(公告)号：US10822465B2

公开(公告)日：2020-11-03

申请号：US15772352

申请日：2016-11-04

Applicant: KANEKA CORPORATION

Inventor： Tetsuya Kogiso ,  Tomohiro Koda ,  Masayoshi Kido

IPC: C08J7/04 ,  B05D7/04 ,  C08G18/75 ,  C08L75/04 ,  C08G18/44 ,  B32B27/20 ,  H05K3/28 ,  B32B27/34 ,  B32B17/06 ,  B32B27/28 ,  B32B15/08 ,  B32B7/12 ,  B32B27/38 ,  B05D3/00 ,  B05D7/24 ,  C08K5/00 ,  C08K5/18 ,  C08K5/3417 ,  C08K5/5313 ,  C08L79/08 ,  C09D4/00 ,  C09D7/63 ,  B05D1/02 ,  C09D175/04 ,  H05K1/03 ,  H05K1/02 ,  B05D3/10 ,  C09D133/10

Abstract: A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 μm or less.

公开(公告)号：US10975263B2

公开(公告)日：2021-04-13

申请号：US16092152

申请日：2017-04-21

Applicant: KANEKA CORPORATION

Inventor： Masayoshi Kido ,  Tetsuya Kogiso ,  Tomohiro Koda ,  Yuji Asahina

IPC: C09D163/04 ,  H05K1/03 ,  C08L63/00 ,  C08K5/00 ,  C08K5/10 ,  C08K5/49 ,  C09D7/40 ,  C09D5/18 ,  C09D133/10 ,  C09D163/00 ,  C09D175/04 ,  H05K3/28

Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.