Invention Grant
- Patent Title: Sputtering target, method for manufacturing sputtering target, and method for forming thin film
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Application No.: US15189104Application Date: 2016-06-22
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Publication No.: US10889888B2Publication Date: 2021-01-12
- Inventor: Shunpei Yamazaki , Tetsunori Maruyama , Yuki Imoto , Hitomi Sato , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Takashi Shimazu
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP2011-128750 20110608,JP2011-274954 20111215
- Main IPC: C23C14/08
- IPC: C23C14/08 ; C23C14/34 ; C23C14/54 ; C04B35/01 ; C04B35/453 ; C04B35/64 ; B28B11/24 ; H01L21/02 ; H01L29/24 ; H01L29/66 ; H01L29/786

Abstract:
There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
Public/Granted literature
- US20170016108A1 Sputtering Target, Method For Manufacturing Sputtering Target, And Method For Forming Thin Film Public/Granted day:2017-01-19
Information query
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