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1.
公开(公告)号:US10889888B2
公开(公告)日:2021-01-12
申请号:US15189104
申请日:2016-06-22
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Tetsunori Maruyama , Yuki Imoto , Hitomi Sato , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Takashi Shimazu
IPC: C23C14/08 , C23C14/34 , C23C14/54 , C04B35/01 , C04B35/453 , C04B35/64 , B28B11/24 , H01L21/02 , H01L29/24 , H01L29/66 , H01L29/786
Abstract: There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
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公开(公告)号:US10217796B2
公开(公告)日:2019-02-26
申请号:US15594813
申请日:2017-05-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Kenichi Okazaki , Mitsuo Mashiyama , Takuya Handa , Masahiro Watanabe , Hajime Tokunaga
IPC: H01L27/12 , H01L27/24 , H01L29/786 , G02F1/1368 , H01L21/70 , H01L27/105 , H01L29/24 , H01L51/50
Abstract: Stable electrical characteristics of a transistor including an oxide semiconductor layer are achieved. A highly reliable semiconductor device including the transistor is provided. The semiconductor device includes a multilayer film formed of an oxide layer and an oxide semiconductor layer, a gate insulating film in contact with the oxide layer, and a gate electrode overlapping with the multilayer film with the gate insulating film interposed therebetween. The oxide layer contains a common element to the oxide semiconductor layer and has a large energy gap than the oxide semiconductor layer. The composition between the oxide layer and the oxide semiconductor layer gradually changes.
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公开(公告)号:US09660093B2
公开(公告)日:2017-05-23
申请号:US14047209
申请日:2013-10-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Kenichi Okazaki , Mitsuo Mashiyama , Takuya Handa , Masahiro Watanabe , Hajime Tokunaga
IPC: H01L29/786 , H01L27/12
CPC classification number: H01L27/1248 , G02F1/1368 , H01L21/70 , H01L27/1052 , H01L27/1225 , H01L29/24 , H01L29/78648 , H01L29/7869 , H01L29/78693 , H01L51/50
Abstract: Stable electrical characteristics of a transistor including an oxide semiconductor layer are achieved. A highly reliable semiconductor device including the transistor is provided. The semiconductor device includes a multilayer film formed of an oxide layer and an oxide semiconductor layer, a gate insulating film in contact with the oxide layer, and a gate electrode overlapping with the multilayer film with the gate insulating film interposed therebetween. The oxide layer contains a common element to the oxide semiconductor layer and has a large energy gap than the oxide semiconductor layer. The composition between the oxide layer and the oxide semiconductor layer gradually changes.
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公开(公告)号:US12230718B2
公开(公告)日:2025-02-18
申请号:US17533588
申请日:2021-11-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Yasuharu Hosaka , Mitsuo Mashiyama , Kenichi Okazaki
IPC: H01L29/786 , H01L29/66 , H10K59/12 , H10K59/121
Abstract: A circuit capable of high-speed operation and a pixel are integrally formed over the same substrate. A first metal oxide film, a first metal film, and an island-shaped first resist mask are formed over a first insulating layer. An island-shaped first metal layer and an island-shaped first oxide semiconductor layer are formed and a part of a top surface of the first insulating layer is exposed; then, the first resist mask is removed. A second metal oxide film, a second metal film, and an island-shaped second resist mask are formed over the first metal layer and the first insulating layer. An island-shaped second metal layer and an island-shaped second oxide semiconductor layer are formed; then, the second resist mask is removed. The first metal layer and the second metal layer are removed.
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公开(公告)号:US11489077B2
公开(公告)日:2022-11-01
申请号:US17000580
申请日:2020-08-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Hideyuki Kishida
IPC: H01L29/786 , H01L21/02 , H01L29/66
Abstract: The impurity concentration in the oxide semiconductor film is reduced, and a highly reliability can be obtained.
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公开(公告)号:US20190189856A1
公开(公告)日:2019-06-20
申请号:US16270252
申请日:2019-02-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yoshiaki OIKAWA , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada , Satoshi Seo
CPC classification number: H01L33/44 , H01L51/003 , H01L51/5237 , H01L51/524 , H01L51/5253 , H01L51/56 , H01L2227/323 , H01L2227/326
Abstract: An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
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公开(公告)号:US10079330B2
公开(公告)日:2018-09-18
申请号:US14511742
申请日:2014-10-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada , Satoshi Seo
CPC classification number: H01L33/44 , H01L51/003 , H01L51/5237 , H01L51/524 , H01L51/5253 , H01L51/56 , H01L2227/323 , H01L2227/326
Abstract: An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
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8.
公开(公告)号:US12252775B2
公开(公告)日:2025-03-18
申请号:US18633854
申请日:2024-04-12
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei Yamazaki , Tetsunori Maruyama , Yuki Imoto , Hitomi Sato , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Takashi Shimazu
IPC: C23C14/34 , B28B11/24 , C04B35/453 , C04B35/64 , C23C14/08 , H01L21/02 , H01L29/24 , H01L29/66 , H01L29/786
Abstract: There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
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公开(公告)号:US12170339B2
公开(公告)日:2024-12-17
申请号:US18243688
申请日:2023-09-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Hideyuki Kishida
IPC: H01L29/786 , H01L21/02 , H01L21/8234 , H01L27/12 , H01L29/66
Abstract: The impurity concentration in the oxide semiconductor film is reduced, and a highly reliability can be obtained.
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公开(公告)号:US11967648B2
公开(公告)日:2024-04-23
申请号:US17967001
申请日:2022-10-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Masahiro Watanabe , Mitsuo Mashiyama , Kenichi Okazaki , Motoki Nakashima , Hideyuki Kishida
IPC: H01L29/786 , H01L21/02 , H01L21/8234 , H01L27/12 , H01L29/66
CPC classification number: H01L29/7869 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L21/823412 , H01L21/82345 , H01L21/823475 , H01L27/1225 , H01L27/1229 , H01L27/1233 , H01L29/66969 , H01L29/78603 , H01L29/78606 , H01L29/78618 , H01L29/78672
Abstract: The impurity concentration in the oxide semiconductor film is reduced, and a highly reliability can be obtained.
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