- Patent Title: Photosensitive resin composition and cured film prepared therefrom
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Application No.: US15725388Application Date: 2017-10-05
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Publication No.: US10942449B2Publication Date: 2021-03-09
- Inventor: Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
- Applicant: Rohm and Haas Electronic Materials Korea Ltd.
- Applicant Address: KR Cheonan
- Assignee: Rohm and Haas Electronic Materials Korea Ltd.
- Current Assignee: Rohm and Haas Electronic Materials Korea Ltd.
- Current Assignee Address: KR Cheonan
- Agent S. Matthew Cairns
- Priority: KR10-2016-0128259 20161005,KR10-2017-0117938 20170914
- Main IPC: G03F7/075
- IPC: G03F7/075 ; G03F7/004 ; G03F7/023 ; C08L83/04 ; G03F7/022 ; G03F7/039 ; C08G77/04

Abstract:
The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
Public/Granted literature
- US20180095365A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM Public/Granted day:2018-04-05
Information query
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