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公开(公告)号：US20220155685A1
公开(公告)日：2022-05-19
申请号：US17525401
申请日：2021-11-12
Inventor： Jin Kwon , Kyu-Cheol Lee
Abstract: The present invention provides a photosensitive resin composition capable of forming a cured film having excellent resolution and chemical resistance upon curing at low temperatures and to a cured film prepared therefrom. In the photosensitive resin composition of the present invention, the first copolymer and the second copolymer are used as a binder to introduce appropriate amounts of a succinate group and an epoxy group to the composition. Thus, it is possible to prepare a cured film that can be sufficiently cured even at low temperatures by enhancing the degree of curing and that has excellent resolution through the control of the developability and enhancements in the crosslinking reaction. Further, the composition has enhanced chemical resistance to chemical solvents or cleaning solvents, whereby deformation of the cured film can be prevented.
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公开(公告)号：US20180307141A1
公开(公告)日：2018-10-25
申请号：US15769944
申请日：2016-09-23
Inventor： Jin Kwon , Geun Huh , Jong-Ho Na , Jong Han Yang
CPC classification number: G03F7/0757 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a siloxane polymer, a 1,2-quinonediazide compound, an epoxy compound and at least one silane compound represented by formula 1. The silane compound together with the epoxy compound in the resin composition further reduces the number of highly reactive silanol group present in the siloxane polymer. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximized to provide a cured film having excellent stability.
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公开(公告)号：US20180314153A1
公开(公告)日：2018-11-01
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , C08G77/18 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/004 , C08G77/24 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L21/3105 , H01L27/32 , H01L27/12
CPC classification number: G03F7/0757 , G03F7/0046 , G03F7/0226 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
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公开(公告)号：US20210149306A1
公开(公告)日：2021-05-20
申请号：US17084222
申请日：2020-10-29
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD
Inventor： Jin Kwon , Su Min Lee , Ho-Suk Song
Abstract: The present invention relates to a photosensitive resin composition and an insulation film prepared therefrom. The photosensitive resin composition is capable of preparing a colored insulation film without a dye. In addition, the photosensitive resin composition is capable of being cured at a low temperature and preparing an insulation film that is excellent in all of such characteristics as film strength, hardness, and resolution.
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Patent Agency Ranking
公开(公告)号：US10890846B2
公开(公告)日：2021-01-12
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , G03F7/004 , G03F7/022 , G03F7/023 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/038 , G03F7/039 , H01L21/3105 , H01L27/12 , H01L27/32 , C08G77/18 , C08G77/24
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
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公开(公告)号：US20180095365A1
公开(公告)日：2018-04-05
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
CPC classification number: G03F7/0048 , C08G77/04 , C08L83/04 , G03F7/0226 , G03F7/0233 , G03F7/039 , G03F7/0755 , G03F7/0757 , C08K5/28 , C08K5/08 , C08K5/01
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
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公开(公告)号：US20210149305A1
公开(公告)日：2021-05-20
申请号：US17084195
申请日：2020-10-29
Inventor： Su Min Lee , Jin Kwon , Ho-Suk Song
Abstract: The present invention relates to a photosensitive resin composition and an insulation film prepared therefrom. Since the photosensitive resin composition comprises a blocked isocyanate-based compound, it can form a transparent insulation film while it maintains excellent film retention rate, hardness, and resolution.
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公开(公告)号：US10942449B2
公开(公告)日：2021-03-09
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
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公开(公告)号：US20190137877A1
公开(公告)日：2019-05-09
申请号：US16097883
申请日：2017-03-29
Inventor： Jong Han Yang , Geun Huh , Jin Kwon , Jong-Ho Na
Abstract: The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide. The composition keeps high transparency and high sensitivity, which are advantages of a composition containing a siloxane polymer, and has excellent chemical resistance, thereby providing a cured film having excellent stability in a post-processing.
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