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1.发明申请公开(公告)号：US20180305313A1
公开(公告)日：2018-10-25
申请号：US15769875
申请日：2016-09-23
Inventor： Seok-Bong Park , Gyung-Sik Choi , Yeonok Kim
IPC: C07D209/82 , C07D251/12 , C07D317/10 , C07D405/12 , G03F7/00 , G03F7/029 , G03F7/031 , G03F7/038 , G03F7/105
CPC classification number: C07D209/82 , C07D251/12 , C07D317/10 , C07D405/12 , G03F7/0007 , G03F7/029 , G03F7/031 , G03F7/0388 , G03F7/105
Abstract: Disclosed herein is a colored photosensitive resin composition including a copolymer, an epoxy resin compound or a compound derived therefrom, a polymerizable compound, a photoinitiator, and a colorant, wherein the photoinitiator includes an oxime compound and a triazine compound. The composition, when formed into a cured film, may facilitate the fabrication of necessary height difference and satisfy the requirements of sensitivity and an exposure margin for light shielding spacers, and, thus, is useful as a material for manufacturing a light shielding spacer such as a black column spacer used in various electronic parts including the panels of an LCD and an OLED display.
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公开(公告)号：US11106133B2
公开(公告)日：2021-08-31
申请号：US16192013
申请日：2018-11-15
Inventor： Yeonok Kim , Geun Huh , Ju-Young Jung , Jung-Hwa Lee , Jong Han Yang
IPC: G03F7/039 , G03F7/075 , G03F7/038 , G03F7/023 , C08G77/392 , C08G77/388 , H01L27/12
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic resin and a siloxane copolymer containing a sulfonated diazoquinone group at the terminal thereof. Thus, the film retention rate and adhesiveness can be further enhanced, while the sensitivity is maintained.
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公开(公告)号：US20180321535A1
公开(公告)日：2018-11-08
申请号：US15774426
申请日：2016-09-28
Inventor： Yeonok Kim , Seok-Bong Park , Gyung-Sik Choi , Su Min Lee
IPC: G02F1/1339 , G02F1/13 , B05D1/32
CPC classification number: G02F1/13394 , B05D1/32 , G02F1/1303 , G02F2001/13398
Abstract: The present invention relates to a method for preparing a column spacer, and is characterized in using a mask including first, second, and third patterns having different light transmittance. In addition, according to the method for preparing a column spacer of the present invention, a taper angle between a matrix part and a spacer part may increase during manufacturing a column spacer in which the matrix part and the spacer part are continuously connected, and critical dimension of the spacer part may decrease. Therefore, a column spacer with fine patterns may be simply and efficiently manufactured.
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公开(公告)号：US11573490B2
公开(公告)日：2023-02-07
申请号：US16879160
申请日：2020-05-20
Inventor： Ji Ung Kim , Geun Huh , Ju-Young Jung , JinKyu Im , Yeonok Kim
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
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Patent Agency Ranking
公开(公告)号：US10859907B2
公开(公告)日：2020-12-08
申请号：US15774426
申请日：2016-09-28
Inventor： Yeonok Kim , Seok-Bong Park , Gyung-Sik Choi , Su Min Lee
IPC: G03F1/50 , G02F1/1339
Abstract: The present invention relates to a method for preparing a column spacer, and is characterized in using a mask including first, second, and third patterns having different light transmittance. In addition, according to the method for preparing a column spacer of the present invention, a taper angle between a matrix part and a spacer part may increase during manufacturing a column spacer in which the matrix part and the spacer part are continuously connected, and critical dimension of the spacer part may decrease. Therefore, a column spacer with fine patterns may be simply and efficiently manufactured.
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公开(公告)号：US20180095365A1
公开(公告)日：2018-04-05
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
CPC classification number: G03F7/0048 , C08G77/04 , C08L83/04 , G03F7/0226 , G03F7/0233 , G03F7/039 , G03F7/0755 , G03F7/0757 , C08K5/28 , C08K5/08 , C08K5/01
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
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公开(公告)号：US11487200B2
公开(公告)日：2022-11-01
申请号：US16402284
申请日：2019-05-03
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD
Inventor： Jung-Hwa Lee , Geun Huh , Ju-Young Jung , Yeonok Kim
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic copolymer having a dissolution rate to a developer in a specific range and a compound containing a phenolic hydroxyl group, so that it is possible to attain a high contrast and a high sensitivity pattern when a cured film is formed. Further, it is possible to further enhance the adhesiveness of a pattern when a half-tone, as well as a full-tone, is formed.
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公开(公告)号：US10942449B2
公开(公告)日：2021-03-09
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
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9.发明申请公开(公告)号：US20200299236A1
公开(公告)日：2020-09-24
申请号：US16899633
申请日：2020-06-12
Applicant: Rohm and Haas Electronic Materials Korea Ltd
Inventor： Seok-Bong Park , Gyung-Sik Choi , Yeonok Kim
IPC: C07D209/82 , C07D251/12 , C07D317/10 , C07D405/12 , G03F7/105 , G03F7/029 , G03F7/031 , G03F7/038 , G03F7/00 , C07D251/24
Abstract: Disclosed herein is a colored photosensitive resin composition including a copolymer, an epoxy resin compound or a compound derived therefrom, a polymerizable compound, a photoinitiator, and a colorant, wherein the photoinitiator includes an oxime compound and a triazine compound. The composition, when formed into a cured film, may facilitate the fabrication of necessary height difference and satisfy the requirements of sensitivity and an exposure margin for light shielding spacers, and, thus, is useful as a material for manufacturing a light shielding spacer such as a black column spacer used in various electronic parts including the panels of an LCD and an OLED display.
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