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公开(公告)号：US11106133B2
公开(公告)日：2021-08-31
申请号：US16192013
申请日：2018-11-15
Inventor： Yeonok Kim , Geun Huh , Ju-Young Jung , Jung-Hwa Lee , Jong Han Yang
IPC: G03F7/039 , G03F7/075 , G03F7/038 , G03F7/023 , C08G77/392 , C08G77/388 , H01L27/12
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic resin and a siloxane copolymer containing a sulfonated diazoquinone group at the terminal thereof. Thus, the film retention rate and adhesiveness can be further enhanced, while the sensitivity is maintained.
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公开(公告)号：US20180314153A1
公开(公告)日：2018-11-01
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , C08G77/18 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/004 , C08G77/24 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L21/3105 , H01L27/32 , H01L27/12
CPC classification number: G03F7/0757 , G03F7/0046 , G03F7/0226 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
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公开(公告)号：US20180307141A1
公开(公告)日：2018-10-25
申请号：US15769944
申请日：2016-09-23
Inventor： Jin Kwon , Geun Huh , Jong-Ho Na , Jong Han Yang
CPC classification number: G03F7/0757 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a siloxane polymer, a 1,2-quinonediazide compound, an epoxy compound and at least one silane compound represented by formula 1. The silane compound together with the epoxy compound in the resin composition further reduces the number of highly reactive silanol group present in the siloxane polymer. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximized to provide a cured film having excellent stability.
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公开(公告)号：US20170038686A1
公开(公告)日：2017-02-09
申请号：US15303624
申请日：2014-04-18
Applicant: Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC , Rohm and Haas Electronic Materials Korea Ltd.
Inventor： Guihong Liao , Yang Li , Peter Trefonas, III , Geun Huh , Hua Ren , Chao He , Yu Cai , Yanping Sun
CPC classification number: G03F7/105 , C09B1/32 , G02B5/223 , G02F1/133514 , G02F2202/02 , G02F2202/04 , G03F7/0007 , G03F7/038
Abstract: An anthraquinone compound which is suitable for forming a color filter used for a liquid crystal display device, a composition containing a resin and the anthraquinone compound, an article having a polymer layer formed from the composition and a color filter containing the compound are developed.
Abstract translation: 适用于形成用于液晶显示装置的滤色器的蒽醌化合物，含有树脂和蒽醌化合物的组合物，具有由该组合物形成的聚合物层的制品和含有该化合物的滤色剂。
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公开(公告)号：US11137682B2
公开(公告)日：2021-10-05
申请号：US16160024
申请日：2018-10-15
Inventor： Kahee Shin , Jong Han Yang , Geun Huh
Abstract: The present invention relates to a photosensitive resin composition that is excellent in adhesiveness and sensitivity. Specifically, the photosensitive resin composition is capable of providing a cured film that is excellent in transparency, sensitivity, chemical resistance, and adhesiveness upon immersion in a stripper. Thus, the cured film can be effectively used in a liquid crystal display, an organic EL display, and the like.
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Patent Agency Ranking
公开(公告)号：US11573490B2
公开(公告)日：2023-02-07
申请号：US16879160
申请日：2020-05-20
Inventor： Ji Ung Kim , Geun Huh , Ju-Young Jung , JinKyu Im , Yeonok Kim
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
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公开(公告)号：US11226558B2
公开(公告)日：2022-01-18
申请号：US16664994
申请日：2019-10-28
Inventor： Kahee Shin , Eun-Young Lee , Jong-Ho Na , Geun Huh
IPC: G03F7/023 , G03F7/033 , G03F7/039 , C08F220/14 , G03F7/031
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.
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公开(公告)号：US10890846B2
公开(公告)日：2021-01-12
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , G03F7/004 , G03F7/022 , G03F7/023 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/038 , G03F7/039 , H01L21/3105 , H01L27/12 , H01L27/32 , C08G77/18 , C08G77/24
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
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公开(公告)号：US20180095365A1
公开(公告)日：2018-04-05
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
CPC classification number: G03F7/0048 , C08G77/04 , C08L83/04 , G03F7/0226 , G03F7/0233 , G03F7/039 , G03F7/0755 , G03F7/0757 , C08K5/28 , C08K5/08 , C08K5/01
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
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公开(公告)号：US11487200B2
公开(公告)日：2022-11-01
申请号：US16402284
申请日：2019-05-03
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD
Inventor： Jung-Hwa Lee , Geun Huh , Ju-Young Jung , Yeonok Kim
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic copolymer having a dissolution rate to a developer in a specific range and a compound containing a phenolic hydroxyl group, so that it is possible to attain a high contrast and a high sensitivity pattern when a cured film is formed. Further, it is possible to further enhance the adhesiveness of a pattern when a half-tone, as well as a full-tone, is formed.
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