- Patent Title: Thin optoelectronic modules with apertures and their manufacture
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Application No.: US16073418Application Date: 2017-02-21
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Publication No.: US11018269B2Publication Date: 2021-05-25
- Inventor: Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang Ng , Simon Gubser , James Eilertsen , Sundar Raman Gnana Sambandam
- Applicant: AMS SENSORS SINGAPORE PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: AMS SENSORS SINGAPORE PTE. LTD.
- Current Assignee: AMS SENSORS SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Michael Best and Friedrich LLP
- International Application: PCT/SG2017/050078 WO 20170221
- International Announcement: WO2017/146645 WO 20170831
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/54 ; H01L33/00 ; H01L33/44 ; H01L33/48 ; H01L31/0203 ; G01S7/481 ; H01L25/16 ; G01S17/02 ; H01L23/00 ; H01L31/0216 ; H01L31/0232 ; H01L31/18 ; G01S17/04

Abstract:
The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
Public/Granted literature
- US20190051762A1 THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE Public/Granted day:2019-02-14
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