公开(公告)号：US10475830B2

公开(公告)日：2019-11-12

申请号：US15750235

申请日：2016-08-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qi Chuan Yu ,  Ji Wang ,  Kyu Won Hwang ,  Jukka Alasimiö

IPC: H01L27/146 ,  H04N9/09 ,  G02B7/02 ,  G03B3/02 ,  G03B5/06 ,  H04N5/225 ,  H05K1/18 ,  H05K3/30

Abstract: An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.

公开(公告)号：US12169315B2

公开(公告)日：2024-12-17

申请号：US16978736

申请日：2019-02-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Qi Chuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kam Wah Leong ,  Kim Lung Ng

IPC: G02B6/36 ,  G02B6/42 ,  H01L27/146 ,  H01L31/0232 ,  H01L33/56

Abstract: An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.

公开(公告)号：US10663698B2

公开(公告)日：2020-05-26

申请号：US15755221

申请日：2016-08-25

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Kam Wah Leong ,  Ji Wang

IPC: G02B7/02 ,  G02B13/00 ,  G02B6/32 ,  H01L27/146 ,  B29C45/14 ,  B29C45/17 ,  B29K63/00 ,  B29L11/00

Abstract: This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

公开(公告)号：US12109771B2

公开(公告)日：2024-10-08

申请号：US17422255

申请日：2020-02-20

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Yeu Woon Chan

IPC: B29D11/00 ,  G02B1/04 ,  G02B5/02

CPC classification number: B29D11/00798 ,  B29D11/00307 ,  G02B5/0268 ,  G02B1/04

Abstract: A method of making optical diffuser elements (20) includes providing a substrate (100) composed of a polymer material and having openings (102) therein. An optical diffuser material (110) is dispensed into the openings (102), and the optical diffuser material (110) is hardened to form a sheet (200) composed of regions of the optical diffuser material (110) surrounded laterally by the polymer material. The method includes separating the sheet (200) into multiple optical diffuser elements (30) that retain their mechanical stability and optical properties when subjected to a reflow process.

公开(公告)号：US11996505B2

公开(公告)日：2024-05-28

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: B29C45/34 ,  B29C33/12 ,  B29C70/88 ,  B29C71/02 ,  B29C71/04 ,  B29D11/00 ,  H01L25/16 ,  H01L33/56 ,  B29C45/00 ,  B29C45/14 ,  B29K63/00 ,  B29L31/34 ,  H05K3/28

CPC classification number: H01L33/56 ,  B29C33/12 ,  B29D11/00307 ,  B29D11/00807 ,  H01L25/167 ,  B29C2045/0075 ,  B29C45/14065 ,  B29C2045/14114 ,  B29C45/14639 ,  B29C2791/006 ,  B29K2063/00 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2933/005 ,  H05K3/284

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

公开(公告)号：US20220190186A1

公开(公告)日：2022-06-16

申请号：US17437607

申请日：2020-03-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Ji Wang ,  QiChuan Yu ,  Alexander Bietsch

IPC: H01L31/12 ,  H01L33/58 ,  H01L31/0232 ,  H01L33/48 ,  H01L31/0203 ,  H01L31/18

Abstract: We disclose an optoelectronic module comprising an optoelectronic device operable to emit or detect a wavelength of radiation, an optical element arranged on the optoelectronic device, the optical element being transparent to the wavelength of radiation capable of being emitted or detected by the optoelectronic device, and a wall configured to laterally enclose the optoelectronic device and the optical element, the wall being opaque to the wavelength of radiation capable of being emitted or detected by the optoelectronic device.

公开(公告)号：US11018269B2

公开(公告)日：2021-05-25

申请号：US16073418

申请日：2017-02-21

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L31/0203 ,  G01S7/481 ,  H01L25/16 ,  G01S17/02 ,  H01L23/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/04

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US12224385B2

公开(公告)日：2025-02-11

申请号：US17297704

申请日：2019-12-05

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L25/16 ,  H01L31/173 ,  H01L33/44 ,  H01L33/58

Abstract: An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

公开(公告)号：US20220020901A1

公开(公告)日：2022-01-20

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: H01L33/56 ,  B29D11/00 ,  H01L25/16 ,  B29C33/12 ,  H01L33/00

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

公开(公告)号：US10510932B2

公开(公告)日：2019-12-17

申请号：US16275422

申请日：2019-02-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.