- 专利标题: Laser machining device and laser oscillator
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申请号: US16167556申请日: 2018-10-23
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公开(公告)号: US11050212B2公开(公告)日: 2021-06-29
- 发明人: Masao Sato , Yu Takabatake , Hideki Yamakawa
- 申请人: Keyence Corporation
- 申请人地址: JP Osaka
- 专利权人: Keyence Corporation
- 当前专利权人: Keyence Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Kilyk & Bowersox, P.L.L.C.
- 优先权: JPJP2017-239907 20171214
- 主分类号: H01S3/11
- IPC分类号: H01S3/11 ; B23K26/36 ; B23K26/082 ; G02B26/10 ; H01S3/0941 ; H01S3/109 ; H01S3/04 ; H01S3/00 ; H01S3/16 ; H01S3/042 ; H01S3/08 ; H01S3/091 ; H01S3/06 ; B23K26/352 ; H01S3/02 ; B23K26/042 ; B23K26/064 ; B23K26/06 ; B23K26/03 ; H01S3/102 ; B23K26/0622 ; B23K26/38 ; B23K26/046 ; H01S3/10 ; H01S3/081 ; H01S3/23
摘要:
To prevent an output decrease of laser light due to impurities formed in a Q switch. A laser machining device includes a Q-switch housing section configured by housing a Q switch and a first mirror and a wavelength converting section including a housing in which a transmission window section capable of transmitting a fundamental wave is formed, the wavelength converting section being configured by airtightly housing, with an internal space surrounded by the housing, at least a first wavelength conversion element, a second wavelength conversion element, and a second mirror. A resonator forming a resonant optical path passing through the transmission window section is configured by the first mirror in the Q-switch housing section and the second mirror in the wavelength converting section.
公开/授权文献
- US20190190227A1 Laser Machining Device And Laser Oscillator 公开/授权日:2019-06-20
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