An embodiment of the invention may include a method of forming a semiconductor structure, and the resulting semiconductor structure. The method may include removing a gate region from a layered stack located on a source/drain layer. The layered stack includes a first spacer located on the source drain layer, a dummy layer located on the first spacer, and a second spacer located on the dummy layer. The method may include forming a channel material above the source/drain layer in the gate region. The method may include forming a top source/drain on the channel material. The method may include forming a hardmask surrounding the top source/drain. The method may include removing a portion of the layered stack that is not beneath the hardmask.