Invention Grant
- Patent Title: Package comprising a substrate having a via wall configured as a shield
-
Application No.: US16704789Application Date: 2019-12-05
-
Publication No.: US11139224B2Publication Date: 2021-10-05
- Inventor: Chaoqi Zhang , Rajneesh Kumar , Li-Sheng Weng , Darryl Sheldon Jessie , Suhyung Hwang , Jeahyeong Han , Xiaoming Chen , Jaehyun Yeon
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/56 ; H01L21/67 ; H01L23/31
Abstract:
A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.
Public/Granted literature
- US20210175152A1 PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SHIELD Public/Granted day:2021-06-10
Information query
IPC分类:
