Invention Grant
- Patent Title: Semiconductor processing stage profiler jig
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Application No.: US16201312Application Date: 2018-11-27
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Publication No.: US11152238B2Publication Date: 2021-10-19
- Inventor: Cheng-Kang Hu , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo , Sheng-Hsiang Chuang , Cheng-Hung Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: G05B19/18
- IPC: G05B19/18 ; H01L21/67 ; H01L21/687
Abstract:
In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.
Public/Granted literature
- US20190164793A1 SEMICONDUCTOR PROCESSING STAGE PROFILER JIG Public/Granted day:2019-05-30
Information query
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