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    WAFER DEBONDING SYSTEM AND METHOD
    4.
    发明申请
    WAFER DEBONDING SYSTEM AND METHOD 审中-公开

    公开(公告)号：US20180147825A1

    公开(公告)日：2018-05-31

    申请号：US15613963

    申请日：2017-06-05

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

    IPC: B32B38/10 ,  H01L21/67 ,  H01L21/683 ,  H01L21/68

    CPC classification number: B32B38/10 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/6838

    Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

    DEFECT OFFSET CORRECTION
    6.
    发明申请
    DEFECT OFFSET CORRECTION 有权

    公开(公告)号：US20220375057A1

    公开(公告)日：2022-11-24

    申请号：US17881338

    申请日：2022-08-04

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Ko Liao ,  Ya-Hsun Hsueh ,  Sheng-Hsiang Chuang ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

    IPC: G06T7/00 ,  G06T7/73 ,  G06T5/00 ,  H01L21/66 ,  G06T7/33

    Abstract: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.

    Wafer debonding system and method
    7.
    发明授权
    Wafer debonding system and method 有权

    公开(公告)号：US10889097B2

    公开(公告)日：2021-01-12

    申请号：US16710348

    申请日：2019-12-11

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

    IPC: B32B38/10 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

    SEMICONDUCTOR EQUIPMENT MANAGEMENT METHOD, ELECTRONIC DEVICE, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM
    8.
    发明申请
    SEMICONDUCTOR EQUIPMENT MANAGEMENT METHOD, ELECTRONIC DEVICE, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM 审中-公开

    公开(公告)号：US20190163149A1

    公开(公告)日：2019-05-30

    申请号：US16028422

    申请日：2018-07-06

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Sing-Tsung Li ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Shou-Wen Kuo ,  Chien-Ko Liao

    IPC: G05B19/042 ,  G06T7/00

    Abstract: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.

    Wafer debonding system and method
    9.
    发明授权
    Wafer debonding system and method 有权

    公开(公告)号：US10155369B2

    公开(公告)日：2018-12-18

    申请号：US15613963

    申请日：2017-06-05

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

    IPC: H01L21/30 ,  B32B38/10 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

    Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

    Defect offset correction
    10.
    发明授权
    Defect offset correction 有权

    公开(公告)号：US11430108B2

    公开(公告)日：2022-08-30

    申请号：US17098895

    申请日：2020-11-16

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Ko Liao ,  Ya-Hsun Hsueh ,  Sheng-Hsiang Chuang ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

    IPC: G06T7/33 ,  G06T7/00 ,  G06T7/73 ,  G06T5/00 ,  H01L21/66

    Abstract: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.

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