公开(公告)号：US11295973B2

公开(公告)日：2022-04-05

申请号：US16787028

申请日：2020-02-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau Wu ,  Cheng-Lung Wu ,  Jiun-Rong Pai ,  Cheng-Kang Hu

IPC: H01L21/677 ,  H01L21/67

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The apparatus includes a base frame and an engaging mechanism disposed on the base frame. The engaging mechanism includes a controller and an active expansion component moveably coupled to the base frame and controlled by the controller to perform a reciprocating movement relative to the base frame. The active expansion component is driven by the controller to pass through the base frame to be engaged with a top flange mounted on the wafer carrier.

公开(公告)号：US11120539B2

公开(公告)日：2021-09-14

申请号：US16204387

申请日：2018-11-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Hsiang Chuang ,  Jiao-Rou Liao ,  Cheng-Kang Hu ,  Shou-Wen Kuo ,  Jiun-Rong Pai ,  Hsu-Shui Liu

IPC: G06T7/00 ,  G06T7/62 ,  G01B11/30 ,  G06T5/00 ,  G01B21/04

Abstract: A method for scanning and analyzing a surface, the method comprising: receiving a piece of equipment with a target surface for inspection; receiving an input from a user; determining at least one scan parameter based on the user input; scanning the target surface using an optical detector in accordance with the at least one scan parameter; generating an image of the target surface; correcting the image of the target surface to remove at least one undesired feature to generate a corrected image based on the at least one scan parameter; and analyzing the corrected image to determine at least one geometric parameter of the target surface.

公开(公告)号：US10569520B2

公开(公告)日：2020-02-25

申请号：US16220163

申请日：2018-12-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

IPC: B32B38/10 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

公开(公告)号：US12153433B2

公开(公告)日：2024-11-26

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Cheng-Hung Chen ,  Yan-Han Chen ,  Feng-Kuang Wu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US11929271B2

公开(公告)日：2024-03-12

申请号：US16927089

申请日：2020-07-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Shou-Wen Kuo ,  Sheng-Hsiang Chuang ,  Jiun-Rong Pai ,  Hsu-Shui Liu

IPC: H01L21/67 ,  G01M3/38 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G01M3/38 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/67772

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20210249282A1

公开(公告)日：2021-08-12

申请号：US16787028

申请日：2020-02-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau Wu ,  Cheng-Lung Wu ,  Jiun-Rong Pai ,  Cheng-Kang Hu

IPC: H01L21/677 ,  H01L21/67

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The apparatus includes a base frame and an engaging mechanism disposed on the base frame. The engaging mechanism includes a controller and an active expansion component moveably coupled to the base frame and controlled by the controller to perform a reciprocating movement relative to the base frame. The active expansion component is driven by the controller to pass through the base frame to be engaged with a top flange mounted on the wafer carrier.

公开(公告)号：US10889097B2

公开(公告)日：2021-01-12

申请号：US16710348

申请日：2019-12-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

IPC: B32B38/10 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

公开(公告)号：US10155369B2

公开(公告)日：2018-12-18

申请号：US15613963

申请日：2017-06-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

IPC: H01L21/30 ,  B32B38/10 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

公开(公告)号：US12165906B2

公开(公告)日：2024-12-10

申请号：US16598136

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau Wu ,  Yan-Han Chen ,  Cheng-Kang Hu ,  Feng-Kuang Wu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/687 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H01L21/677 ,  H04N23/56

Abstract: An apparatus for handling semiconductor part carriers includes: a mechanical arm and an imaging system coupled to the mechanical arm, wherein the mechanical arm is configured for holding a semiconductor part carrier, and the imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US11670524B2

公开(公告)日：2023-06-06

申请号：US17110122

申请日：2020-12-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Fei Yu ,  Chang-Chen Tsao ,  Ting-Yau Shiu ,  Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/02 ,  H01L21/67 ,  H01L23/00 ,  B32B43/00 ,  H01L21/66

CPC classification number: H01L21/02032 ,  B32B43/006 ,  H01L21/02079 ,  H01L21/67092 ,  H01L22/12 ,  H01L24/799 ,  H01L24/98 ,  B32B2457/14

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.