Invention Grant
- Patent Title: Integrated circuit heat dissipation using nanostructures
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Application No.: US16587290Application Date: 2019-09-30
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Publication No.: US11152495B2Publication Date: 2021-10-19
- Inventor: Alan B. Botula , Max L. Lifson , James A. Slinkman , Theodore G. Van Kessel , Randy L. Wolf
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L29/732
- IPC: H01L29/732 ; H01L23/373 ; H01L29/78 ; H01L29/45 ; H01L23/525 ; H01L21/02 ; H01L21/285 ; H01L29/10 ; H01L29/08 ; H01L49/02 ; H01L29/06 ; H01L21/762 ; B82Y10/00 ; H01L29/417 ; H01L29/41 ; H01L23/367 ; H01L21/48 ; H01L21/288 ; H01L21/3205 ; H01L23/48 ; H01L23/485 ; H01L29/66
Abstract:
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.
Public/Granted literature
- US20200027973A1 INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES Public/Granted day:2020-01-23
Information query
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