Invention Grant
- Patent Title: Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
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Application No.: US15942263Application Date: 2018-03-30
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Publication No.: US11291115B2Publication Date: 2022-03-29
- Inventor: Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/40 ; H01L21/48 ; H01R12/88 ; H01R12/70 ; H05K7/20 ; H05K1/02
Abstract:
A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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