- 专利标题： Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
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申请号： US15942263申请日： 2018-03-30
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公开(公告)号： US11291115B2公开(公告)日： 2022-03-29
- 发明人: Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Essential Patents Group, LLP.
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L23/40 ; H01L21/48 ; H01R12/88 ; H01R12/70 ; H05K7/20 ; H05K1/02
摘要：
A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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