公开(公告)号：US11296009B2

公开(公告)日：2022-04-05

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02 ,  H01R13/629 ,  H05K7/20

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC: H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H01L23/40 ,  H05K7/14 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H05K7/14 ,  H01L23/40 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US20190304871A1

公开(公告)日：2019-10-03

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.