公开(公告)号：US11296009B2

公开(公告)日：2022-04-05

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02 ,  H01R13/629 ,  H05K7/20

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC: H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US10455685B1

公开(公告)日：2019-10-22

申请号：US16159840

申请日：2018-10-15

Applicant: Intel Corporation

Inventor： Steven A. Klein ,  Kuang Liu ,  Thomas A. Boyd ,  Luis Gil Rangel ,  Muffadal Mukadem ,  Shelby A. Ferguson ,  Francis Toth, Jr. ,  Eric Buddrius ,  Ralph V. Miele ,  Sriram Srinivasan ,  Jeffory L. Smalley

IPC: H01L23/522 ,  H01L23/485 ,  H01L23/32 ,  H05K1/02 ,  H05K3/30 ,  H01R12/70 ,  H05K7/10 ,  H01L23/367 ,  H05K3/36

Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

公开(公告)号：US20190304871A1

公开(公告)日：2019-10-03

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US09991223B2

公开(公告)日：2018-06-05

申请号：US14975532

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Michael R. Hui ,  Jonathon R. Carstens ,  Michael S. Brazel ,  Daniel P. Carter ,  Thomas A. Boyd ,  Shelby A. Ferguson ,  Rashelle Yee ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Anthony P. Valpiani

IPC: B23K3/08 ,  H04L23/00 ,  H01L23/00 ,  B23K1/00 ,  B23K101/42

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/087 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/75703 ,  H01L2224/75754 ,  H01L2224/81139 ,  H01L2224/81234 ,  H01L2924/15311 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/166 ,  H05K2203/167 ,  Y02P70/613

Abstract: Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed.