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公开(公告)号：US11291115B2
公开(公告)日：2022-03-29
申请号：US15942263
申请日：2018-03-30
申请人： Intel Corporation
发明人： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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公开(公告)号：US11032941B2
公开(公告)日：2021-06-08
申请号：US16368341
申请日：2019-03-28
申请人： Intel Corporation
发明人： Minh Le , Thomas Boyd , Bijoyraj Sahu , Evan Chenelly , Christopher Wade Ackerman , Carlos Alvizo Flores , Craig Jahne
IPC分类号： H05K7/20
摘要： Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.
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公开(公告)号：US20240345639A1
公开(公告)日：2024-10-17
申请号：US18755226
申请日：2024-06-26
申请人： Intel Corporation
发明人： Andres Ramirez Macias , Aardra B. Athalye , Devdatta Prakash Kulkarni , Gilberto Rayas Paredes , Bijoyraj Sahu
CPC分类号： G06F1/206 , H05K1/0272 , G06F2200/201
摘要： Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.
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公开(公告)号：US20190223324A1
公开(公告)日：2019-07-18
申请号：US16368341
申请日：2019-03-28
申请人： Intel Corporation
发明人： Minh Le , Thomas Boyd , Bijoyraj Sahu , Evan Chenelly , Christopher Wade Ackerman , Carlos Alvizo Flores , Craig Jahne
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , H05K7/20236 , H05K7/20272 , H05K7/20409 , H05K7/20509 , H05K7/20781 , H05K7/20836
摘要： Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.
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公开(公告)号：US20230197622A1
公开(公告)日：2023-06-22
申请号：US17559431
申请日：2021-12-22
申请人： Intel Corporation
发明人： Karumbu Meyyappan , Jeffory L, Smalley , Gregorio Murtagian , Srikant Nekkanty , Pooya Tadayon , Eric J.M. Moret , Bijoyraj Sahu
IPC分类号： H01L23/538 , H01L23/498 , H01R12/52 , H01L25/00 , H01L25/18 , H01L25/065 , H01R12/58 , H05K3/32 , H05K1/18
CPC分类号： H01L23/5384 , H01L23/49827 , H01L23/5385 , H01R12/52 , H01L25/50 , H01L25/18 , H01L25/0655 , H01R12/58 , H05K3/32 , H05K1/181 , H05K2201/10189 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053
摘要： An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interposer surface, and a second interposer surface; a processor package including at least one processor integrated circuit (IC), the processor package attached to the first interposer surface and electrically connected to the interposer interconnect; a first liquid metal well array including multiple liquid metal wells attached to a second interposer surface and the interposer interconnect; a second liquid metal well array including a first array surface attached to the first interposer surface and the interposer interconnect; and a packaged companion IC to the processor IC attached to a second array surface of the second liquid metal well array.
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公开(公告)号：US20220415742A1
公开(公告)日：2022-12-29
申请号：US17356239
申请日：2021-06-23
申请人： Intel Corporation
发明人： Bijoyraj Sahu , Tolga Acikalin , Anand Haridass , Vikrant Thigle
摘要： Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate, and a die, electrically coupled to the package substrate, including a silicon substrate having a first surface and an opposing second surface; a device layer at the first surface of the silicon substrate; and a dielectric layer, having a heater trace, at the second surface of the silicon substrate.
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公开(公告)号：US11387163B2
公开(公告)日：2022-07-12
申请号：US15942278
申请日：2018-03-30
申请人： Intel Corporation
摘要： A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
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公开(公告)号：US12055986B2
公开(公告)日：2024-08-06
申请号：US17187164
申请日：2021-02-26
申请人： Intel Corporation
发明人： Andres Ramirez Macias , Aardra B. Athalye , Devdatta Prakash Kulkarni , Gilberto Rayas Paredes , Bijoyraj Sahu
CPC分类号： G06F1/206 , H05K1/0272 , G06F2200/201
摘要： A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.
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公开(公告)号：US20210208647A1
公开(公告)日：2021-07-08
申请号：US17187164
申请日：2021-02-26
申请人： Intel Corporation
发明人： Andres Ramirez Macias , Aardra B. Athalye , Devdatta Prakash Kulkarni , Gilberto Rayas Paredes , Bijoyraj Sahu
摘要： A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.
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公开(公告)号：US20190304869A1
公开(公告)日：2019-10-03
申请号：US15942278
申请日：2018-03-30
申请人： Intel Corporation
摘要： A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
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