Invention Grant
- Patent Title: Method and apparatus for detaching a microprocessor from a heat sink
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Application No.: US15942275Application Date: 2018-03-30
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Publication No.: US11296009B2Publication Date: 2022-04-05
- Inventor: Rolf Laido , Divya Swamy Bandaru , Thomas Boyd , Jorge Contreras Perez , Shelby A. Ferguson , Mustafa Haswarey
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H05K1/02 ; H01R13/629 ; H05K7/20
Abstract:
A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
Public/Granted literature
- US20190304871A1 METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK Public/Granted day:2019-10-03
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