公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

申请人： Intel Corporation

发明人： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC分类号： H01L23/40 ,  H05K7/14 ,  H01L23/367

摘要： A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11296009B2

公开(公告)日：2022-04-05

申请号：US15942275

申请日：2018-03-30

申请人： Intel Corporation

发明人： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC分类号： H01L23/40 ,  H05K1/02 ,  H01R13/629 ,  H05K7/20

摘要： A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US11271335B2

公开(公告)日：2022-03-08

申请号：US16017026

申请日：2018-06-25

申请人： Intel Corporation

发明人： Mustafa H. Haswarey ,  Ming-Chen Chang ,  Divya Swamy Bandaru

IPC分类号： H05K7/14 ,  H05K7/18 ,  H01R12/70 ,  G06F1/20

摘要： Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

申请人： Intel Corporation

发明人： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC分类号： H05K7/14 ,  H01L23/40 ,  H01L23/367

摘要： A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US20190304871A1

公开(公告)日：2019-10-03

申请号：US15942275

申请日：2018-03-30

申请人： Intel Corporation

发明人： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC分类号： H01L23/40 ,  H05K1/02

摘要： A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.